高级电子质量工程师
Senior Electronics Quality Engineer
职位名称：高级电子质量工程师
职位类型：承包商
工作地点：远程（优先考虑美国本地）
micro1 正在寻找高级电子质量工程师，为专注于先进电子组装和检测的客户项目提供专业知识。在此职位上，您将运用专业知识帮助培训下一代人工智能系统。您的工作将影响模型如何通过高质量的真实输入进行学习、推理和执行。无需人工智能相关经验——您的专业领域知识才是关键。
工作职责
- 审查和评估 PCB CAM 和 Gerber 文件的可制造性、质量和符合行业标准的情况。
- 执行 IPC 610 和 IPC 620 视觉检查，并对 PCB 组装或线束构建提供详细反馈。
- 分析并记录表面贴装（SMT）和自动光学检测（AOI）缺陷类型，包括 AOI 虚警的识别和根本原因分析。
- 运用符合 AS6081 标准的假冒电子元件检测专业知识，提供风险缓解的可操作见解。
- 使用 C-SAM 和 X 射线成像进行先进的半导体封装检查，包括芯片检查和 MIL-STD-883 合规性检查。
- 编写简洁、清晰的报告，并向技术和非技术利益相关者口头阐述发现。
- 与项目负责人合作，优化工作流程并提升 AI 开发的训练数据集。
优先资格
- 在电子质量、CAM 工程或失效分析领域有 8 年以上实际工作经验，特别是在 PCB 组装、线束或半导体封装领域。
- 精通 IPC-A-610 和 IPC/WHMA-A-620 检查标准；持有 IPC CIS/CIT 认证者优先。
- 有审查 Gerber 数据并使用 PCB CAM 软件进行可制造性和质量保证的经验。
- 精通 SMT 工艺、AOI 缺陷分析以及自动化检测系统中虚警的修复。
- 直接参与按照 AS6081 标准进行的假冒元件筛选，了解风险指标和缓解策略。
- 熟练使用 C-SAM 和 X 射线等半导体检测工具，同时熟悉 MIL-STD-883 流程。
- 具备出色的书面和口头沟通能力，确保文档和知识传递的清晰度。
最初发布于 Himalayas
查看英文原文
**Pay:** $70-$120 per hour (USD).
Role Title: Senior Electronics Quality Engineer
Role Type: Contractor
Location: Remote (US-based preferred)
micro1 is engaging Senior Electronics Quality Engineers to contribute expert knowledge to a customer's project focused on advanced electronics assembly and inspection. In this role, you'll apply your expertise to help train next-generation AI systems. Your work will shape how models learn, reason, and perform through high-quality, real-world input. No prior experience in AI is required — your domain knowledge is what matters.
Scope of Work
1. Review and evaluate PCB CAM and Gerber files for manufacturability, quality, and compliance with industry standards.
2. Perform IPC 610 and IPC 620 visual inspections and provide detailed feedback on PCB assembly or wire harness builds.
3. Analyze and document surface mount (SMT) and automated optical inspection (AOI) defect types, including the identification and root cause analysis of AOI false calls.
4. Apply expertise in counterfeit electronic part detection aligned with AS6081 standards, delivering actionable insights for risk mitigation.
5. Conduct and interpret advanced semiconductor package inspections using C-SAM and X-ray imaging, including die inspection and MIL-STD-883 compliance checks.
6. Prepare concise, well-written reports and articulate findings verbally to both technical and non-technical stakeholders.
7. Collaborate with project leads to refine workflow processes and enhance training datasets for AI development.
Preferred Qualifications
1. 8+ years of hands-on experience in electronics quality, CAM engineering, or failure analysis, specifically within PCB assembly, wire harness, or semiconductor packaging domains.
2. Extensive expertise in IPC-A-610 and IPC/WHMA-A-620 inspection criteria; IPC CIS/CIT certification strongly preferred.
3. Demonstrated experience reviewing Gerber data and utilizing PCB CAM software for manufacturability and quality assurance.
4. Proficiency in SMT processes, AOI defect analysis, and remediation of false calls in automated inspection systems.
5. Direct involvement in counterfeit component screening per AS6081, with knowledge of risk indicators and mitigation strategies.
6. Hands-on skills with semiconductor inspection tools such as C-SAM and X-ray, alongside familiarity with MIL-STD-883 procedures.
7. Exceptional written and verbal communication skills, ensuring clarity in documentation and knowledge transfer.