Assembly and Packaging Process Engineer
莱特公司在复杂环境中为物理人工智能构建感知系统。该公司将定制，集成传感器和软件结合在一起，成为机器人，移动性和下一代自动化的统一平台。莱特总部位于加利福尼亚州桑尼瓦尔，全球存在。更多信息请访问如果你热衷于在活跃的实践环境中建立有影响力的技术，我们很想听从你！关于角色 · 我们正在寻找一个入门或中层次装配和包装工程师学位电气工程，光学，机械工程师或相关领域。你会做什么？·与亚洲的 OSAT 合作，支持公司对 NPI 和量产设备包装流程的改进。· 与亚洲的 CMM （合同制造商）合作，支持我们的光学发动机和子部件组装和 NPI 和体积生产过程改进。•每周编写技术报告并呈现结果。·分析数据并跟踪 OSAT,汇集室，合约制造商 CPK 进行内部使用。·支持测试和可靠性工作在元器级 CoC,设备级，光学发电机和模块系统组装上。·维护软件和固件支持测试及相关设置。要求资格。· 最低要求是1年经验的学士学位。· 成功考生需要具备英语通信能力。· 有实践性实验室试验和数据分析的经验或知识。·熟悉微软办公室。· 快速学习者必须有。· 良好的工作道德和保持公司机密信息是必需品。· 大于希望获得更多经验的更高水平。·具有微电子设备包装的经验。· 较为理想的光学设备包装前身经验。· 经验实践测试光学和电子设备/组件。· 对至少以下几个领域的设备测试知识和经验：IIIV CoC,晶圆层探测器测试，包装电光装置，组合模块，PCBA. · 至少在以下几种过程中获得知识和经历：IIIV 或 CMOS 晶圆层处理；IIIV 级加工；设备包装工艺如安装，翻转芯片，连接线以及模块机械组件等。
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About Lyte
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Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!
About the role
· We are seeking an entry or middle level assembly and packaging Engineer with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.
What you'll do
- Work with our OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture
- Work with our CMs (contract manufactures) in Asia to support our optical engine and subcomponent assembly and process improvement for NPI and volume manufacture
- Project tracking weekly.
- Write technical reports and present results.
- Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use.
- Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly.
- Maintain the software and firmware support for testing and relevant setups.
Required Qualifications
- Minimal requirement is a bachelor's degree with 1 years of experience.
- The successful candidate need have English communication capability.
- Experience or knowledge of PCB assembly with SMT line
- Hands-on experience in laboratory experimentation and data analysis
- English communication capability is a must.
- Familiar with Microsoft Office.
- Fast learner is a must.
- Good work ethics and Maintain company confidential information are a must
Preferred Qualifications
- Higher degree with more experience is highly desired.
- Experience with microelectronic device packaging.
- Former experience of optical device packaging is highly desirable.
- Experience with hands-on testing of photonic and electronic. device/components.
- Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.
- Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
- Experience in SolidWorks and familiar with Engineering drawing is a plus.
- Data analysis experience such as JMPs is a plus; excel is OK.
- Programming and software maintenance skills are desired eg. python, or C++
- Understanding the microelectronic reliability tests and mechanical reliability tests are desirable.
- Experience in microsystem assembly such as hard disk assembly is a plus.
Benefits (subject to location and local regulations)
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- 401(k) retirement plan
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team
Originally posted on Himalayas